Dow Chemical Introduces Waterborne Adhesives Designed for the Asia Pacific Region

Dow Chemical's packaging and composites business today announced the launch of two new water-based packaging adhesives, ROBONDTML-D95 and ROBONDTML-188, specifically designed for the Asia Pacific region's food packaging market. The introduction of these two products further demonstrates Dow's Market leadership as an innovative solution provider.

The ROBONDTML series uses green technology to help customers produce safer food packaging. To assist local food packaging and manufacturing companies to enhance product performance, increase production efficiency and promote sustainable development, Dow launched two new water-based packaging adhesives specifically for the needs of food packaging manufacturers in the Asia Pacific region. Compared with the generation products, the new generation of water-based packaging adhesives broadens the application range and develops new functions. Among them, ROBONDTML-95D can be used in both transparent and aluminized films; and ROBONDTML-188 is the first flexible packaging adhesive product on the market that effectively solves the friction coefficient problem that often plagues global food packaging manufacturers.

In the food packaging industry, composite manufacturers often need to use different methods to solve the problem of friction coefficient between the film and the machine, such as using more additives to reduce friction. However, these methods may affect the bond strength between layers. ROBONDTML-188 uses state-of-the-art emulsification technology to solve friction problems without sacrificing critical properties such as heat seal strength and bond strength. In addition, ROBONDTML-188 can maintain stable performance in hot and humid environment, so it is more suitable for cities in southern China, Southeast Asia and India.

Dow Asia Pacific Commercial Director Kiattipong Techavachara stated that ROBONDTML-95D and ROBONDTML-188 will be first introduced in the Chinese market and will continue to be extended to Southeast Asia, South Korea, Japan and other Asian countries in the future.