Silicon wafer thickness unevenness preventive measures 1, TV is too large or too small: root calculations according to customer requirements piece thickness, calculate the best cost / quality of the slot pitch, steel wire, silicon carbide, mortar density. 2. The percentage of TTV 15mm wafers is more than 0.62%, which is abnormal. For the one-cut unit, the guide strip should be increased (the part is not provided). The unit for two-cutting is better to change the groove distance of the guide wheel (main roller) or the mortar flow rate when the second cut is 500 kg/hour (5l /min) Replace the 20 kg mortar or more. 3. The inlet end (angular) of the silicon feed is thinner or thicker, and the mortar flow should be modified when feeding. 4. If the thickness of the same wafer is large-small-large-small, the cutting process should be adjusted. Feed, line speed, flow rate should be changed synchronously. 5. Abnormal thickness of a certain blade caused by a jumper, abnormal thickness of the same piece, thickness deviation of different films, etc., due to filtering by adding filter/filter bag/oscillating filter and careful cutting before cutting, no jumper to eliminate .
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Temperature: -20℃-+70℃
Rolling Speed:4 km/h